In the electronics world of today, electronic devices play a very critical role in industries such as, telecom, computers, automotive, aerospace & defense, electrical & electronics, and so on. The components used in these devices also generate a greater amount of heat that can be detrimental to the life of the product. Thermal management is necessary to keep all electronic devices running smoothly. A well-designed thermal management program will keep operating temperatures within acceptable limits in order to optimize performance and reliability. Electronic components, such as semiconductors, are kept within their operating temperature limits by transferring excess heat away from them. This is best accomplished by attaching a heat sink to the component and in lay man’s terms, drawing the heat from the source and transferring it into the air. Once the proper heat sink has been selected, it must be joined to the semiconductor to ensure efficient heat transfer. This combination of parts, called a thermal interface, works best when the joint is as thin as possible, both surfaces are in intimate contact, and air gaps are at a minimum. Air, between the surfaces, acts as a resistor to the heat instead of a conductor.
The report categorizes the TIMs market into the following six different types:
- Greases & Adhesives
- Tapes & Films
- Gap Fillers
- Metal based TIMs
- Phase Change Materials
- Others (elastomeric pads/insulators and thermal compounds)
On the basis of applications, the report categorizes the Thermal Interface Material Market into seven segments:
- Computers
- Telecom
- Medical Devices
- Industrial Machinery
- Consumer Durables
- Automotive Electronics
- Others (military and office equipment)
The global market size, in terms of value, of Thermal Interface Materials is projected to reach $962.0 million by 2020 registering a CAGR of 11.0% between 2015 and 2020.
OEMs in end-use industries such as telecom, medical, and automotive use TIMs in their electronic components and devices to ensure smooth and efficient functioning of these devices. Presently, the major factor restraining the growth of TIMs market is physical properties of TIMs. The past few decades have seen an escalation of power densities in electronic devices, and in particular in microprocessor chips. Together with the continuing trend of reduction in device dimensions this has led to dramatic increase in the thermal issues within electronic circuits. Thermal management is therefore becoming increasingly more critical and fundamental to ensuring that electronic devices operate within their specification.
Although a thermal management system may make use of all modes of heat transfer to maintain temperatures within their appropriate limits and to ensure optimum performance and reliability, conductive heat transfer is typically used to spread the heat out from its point of generation and into the extended surface area of a heat sink. To minimize the contact resistance, thermal interface materials (TIMs) are introduced to the joint to fill the air gaps and are an essential part of an assembly when solid surfaces are attached together. Although the use of TIMs helps to improve heat transfer across an interface, it is widely recognized that TIMs increasingly account for most of the system total thermal resistance.
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