Surface mount technology (SMT) is a method of mounting electronic components directly on the surface of the printed circuit boards (PCBs) to produce surface mount devices (SMDs). With help of this technology, smaller components can be made with leads closer together, packing densities can be increased, components can be mounted on both sides of the board; smaller PCBs can be used for the same electronic systems and drilling of the many through holes during board fabrication is eliminated. The benefits of Surface mount technology also include reduced board cost, reduced material handling cost, and a controlled manufacturing process. Surface mount technology is used extensively in applications such as consumer electronics, automotive, medical, and telecommunication.
APAC is one of the key markets for Surface mount technology due to the broad scope in many consumer electronics applications, particularly in smart phones and tablets. Moreover, growing industrialization in the developing nations of APAC is a positive factor for the growth of this market. Increasing investment in research and development is also one of the key drivers for the growth of the market in APAC. With many new electronics manufacturing projects planned in the region, APAC is expected to be a high growth market for Surface mount technology equipment. Furthermore, increasing penetration of wireless communication standards and rising demand for 3G/4G networks are boosting Surface mount technology demand in the telecommunication sector in this region.
Surface mount technology is observed to have a strong penetration in the consumer electronics sector, which consists of smartphones, tablets, portable media players, set-top boxes & digital TVs, and DVD and Blu-ray players, among others. The smartphones in recent years have been observed to experience a very strong demand, and the need for numerous features packed in a small form factor has also given rise to the SMD solutions in this sector. Thus, consumer electronics application is a key revenue pocket in the Surface mount technology market. China accounted the largest share of this market in the APAC region. The semiconductor & electronics industry is also a pillar of the industries in China since various kinds of electronics & electronics assembly machinery being produced in China. Production of semiconductor & electronics assembly equipment has increased rapidly due to high demand for consumer electronics such as smartphones and tablets in the APAC region.
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The key players in the Surface mount technology market include Nordson Corporation (U.S.), Mycronic AB (Sweden), Fuji Machine Manufacturing Co., Ltd. (Japan), Electro Scientific Industries Inc. (U.S.), and Orbotech Ltd. (Israel), Hitachi High Technologies Corporation (Japan), Viscom AG (Germany), Juki Corporation (Japan), CyberOptics Corporation (U.S.), and ASM Assembly Systems GmbH & Co. KG (Germany).
